. The Bell System technical journal . e of rectifiers for longer modifications and refinements in technique are called for by adecrease in size and the increased frequency of operation. A single-crystal ingot, grown from high purity DuPont silicon dopedwith per cent boron, furnishes the material for the silicon squaresused in the wafer unit. Slices cut from the ingot are polished and heattreated. Gold is evaporated on the back surface and the slices are dicedinto squares approximately square and squares are pressed into indentations form
. The Bell System technical journal . e of rectifiers for longer modifications and refinements in technique are called for by adecrease in size and the increased frequency of operation. A single-crystal ingot, grown from high purity DuPont silicon dopedwith per cent boron, furnishes the material for the silicon squaresused in the wafer unit. Slices cut from the ingot are polished and heattreated. Gold is evaporated on the back surface and the slices are dicedinto squares approximately square and squares are pressed into indentations formed in the ends of copper pins which have previously been tin-plated. The rodsare then cemented in place in the wafer. The spring contact points aremade of pure tungsten wire that has been sized to mil in diameter byan electrolytic etching process. A short length of this wire is spot weldedon the conical end of the nickel rod. The wire is then bent into 1388 THE BELL SYSTEM TECHNICAL JOURNAL, NOVEMBER 1956. Fig. 3 —■ Micro-photograph showing successive stages in the formation of thecontact spring. The posts are 3*0 inch in diameter.
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Keywords: ., bookcentury1900, bookdecade1920, booksubjecttechnology, bookyear1
