ultrasonic bonding of a gold wire during semiconductor device fabrication

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Keywords: ball, bond, bonder, bonding, circuit, closeup, component, connection, copper, device, electrical, electrode, electronics, equipment, gold, industrial, industry, integrated, interconnect, lamp, machine, manufacturing, material, metal, micro, microscope, package, power, process, processing, production, quality, stitch, system, technology, testing, thermosonic, tool, ultrasonic, wedge, welding, wire