. The Bell System technical journal . ,^-ALUMINUM WIRE P + ALUMINUM DOPED,REGROWTH LAYER ^MnY ^-i-r n-TYPE (c) Fig. 2 —■ Schematic illustralioii of (a) double diffused n-p-n wafer, (b) anglesection method of making base contact, and (c) direct alloying method of makingbase contact. DIFFUSED EMITTER AND BASE SILICON TRANSISTORS AU-Sb PLATEDPOINT VAPORIZED Al CM WIDE. t MM

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Keywords: ., bookcentury1900, bookdecade1920, booksubjecttechnology, bookyear1